Vertiv Coolchip CDU121 Next-Generation Cooling for AI Systems

The Vertiv CoolChip CDU121 is the new standard in high-density liquid cooling. Developed to support NVIDIA NVL72 GB200 systems, it delivers up to 121 kW cooling capacity in a compact 4RU form factor.
Designed for efficiency and reliability, the CDU121 enables seamless thermal management in AI-driven data centers and HPC environments.

Key Benefits:

  • Optimized for AI and HPC workloads
  • Compact, modular design
  • Flexible power and connection options
  • High efficiency, low maintenance

 

Key Specs:

  • Cooling capacity: 121 kW @ 4°C ATD
  • Fluid flow: 120 L/min @ 1.15 bar
  • Fluid type: Water or PG-25
  • Power: 115/230VAC, 1PH or 48VDC
  • Connection: 1.5” sanitary flange, rear access

Download brochure here.

Experience the power of precise cooling — with Vertiv CoolChip CDU121.

 

Vertiv™ ‘s Liebert® XDU 070 and XDU 350 liquid cooling row CDUs

Next Generation Liquid Cooling Distribution Technology.

Confidently Manage High-Density Thermal Loads.

The Vertiv™ Liebert® XDU070 and XDU350 systems (with cooling capacities of 70 kW and 350 kW, respectively) are precision-engineered for direct-to-chip cooling applications, providing an effective solution for high-density data centers and air-cooled environments. These advanced Liquid-to-Air Coolant Distribution Units (CDUs) enable the integration of liquid cooling into existing infrastructure, supporting the increasing need for powerful AI applications and high-performance computing (HPC) systems.

Key Features:

  • Effortless Integration into Air-Cooled Data Centers

    Vertiv™ Liebert® CDUs are designed to easily accommodate liquid cooling technologies within traditional air-cooled data centers. This allows businesses to scale their operations with high-density servers and cutting-edge technologies without the need for expensive infrastructure overhauls.

  • Enhanced Cooling Performance for Advanced Applications

    With cooling capacities of 70 kW (XDU070) and 350 kW (XDU350), these systems provide the necessary thermal management to support demanding applications, including high-performance computing, AI, and machine learning, while maintaining efficiency and reliability.

  • Strict Water Quality Control

    Vertiv™ ensures optimal cooling system performance through rigorous water quality control. This is critical for maintaining the operational integrity of liquid cooling solutions, helping extend the lifespan of your systems and reduce the risk of failure.

  • Built for Mission-Critical Environments

    Designed with resilience in mind, the Vertiv™ Liebert® XDU systems deliver unmatched reliability for mission-critical applications. These systems operate seamlessly, ensuring your data center’s cooling is always up to the task, even in the most challenging conditions.

 

Vertiv™ ‘s Liebert® XDU 600, 1350 and 2300 liquid cooling row CDUs

The Vertiv CoolChip CDU 600 is a high-capacity liquid-to-liquid coolant distribution unit designed for AI pods, GPU clusters, and growing liquid-cooled environments. Positioned between the facility water loop and the IT secondary circuit, it provides efficient heat transfer, scalability, and operational reliability for medium-to-large liquid-cooling deployments. 

Key Benefits 

  • Optimised for AI and GPU-dense rack clusters 
  • Scalable capacity for multi-rack liquid-cooled environments 
  • Separation between facility water and IT coolant loops 
  • Compact footprint suitable for end-of-row or perimeter installation 
  • Designed for high-temperature, energy-efficient cooling strategies 

Technical Highlights 

  • Cooling capacity: Up to 600 kW 
  • Cooling type: Liquid-to-liquid plate heat exchanger 
  • Pumping: Variable-speed pumps with redundancy options 
  • Fluids: Water or water-glycol mixtures 
  • Controls: Integrated monitoring, alarms, and BMS connectivity 
  • Deployment: End-of-row or perimeter CDU 

 Vertiv XDU 1350 (Liquid-to-Liquid CDU) 

The Vertiv XDU 1350 is a proven, high-capacity liquid-to-liquid CDU widely deployed in large AI and HPC facilities worldwide. It delivers robust cooling capacity and high flow rates, making it suitable for large liquid-cooled clusters and dense compute halls requiring reliable, enterprise-grade infrastructure. 

Key Benefits 

  • Proven platform for large AI and HPC deployments 
  • High cooling capacity with low approach temperature 
  • Supports large secondary-loop flow rates 
  • Full isolation between facility and IT coolant circuits 
  • Designed for continuous, mission-critical operation 

Technical Highlights 

  • Cooling capacity: Up to 1,350 kW 
  • Cooling type: Liquid-to-liquid plate heat exchanger 
  • Flow capability: High secondary-loop flow for multi-rack clusters 
  • Pumping: Redundant, variable-speed pumps 
  • Filtration: Integrated filtration for fluid quality control 
  • Controls: Advanced HMI with full BMS integration 

 Vertiv CoolChip CDU 2300 (Liquid-to-Liquid CDU) 

The CoolChip CDU 2300 is a hyperscale-class coolant distribution unit engineered for the most demanding AI and HPC environments. 

Key Benefits 

  • Designed for hyperscale AI and HPC deployments 
  • Ultra-high capacity for large liquid-cooled clusters 
  • Supports future AI architectures and rack densities 
  • Enterprise-grade redundancy, monitoring, and serviceability 
  • Optimised for low approach temperatures and high flow rates 

Technical Highlights 

  • Cooling capacity: Up to 2,300 kW 
  • Heat exchanger: High-performance liquid-to-liquid plate HX 
  • Flow capability: Very high secondary-loop flow to support large clusters 
  • Pumping system: Redundant, variable-speed pumps 
  • Filtration & protection: Integrated filtration and system safeguards 
  • Controls: Advanced monitoring with full BMS integration 

Ideal for: 
Hyperscale data centers, large AI training halls, national AI infrastructure, and ultra-dense HPC facilities. 

 

 

Vertiv’s Liquid Cooling implementation support is available in Israel from Alexander Schneider’s experienced Thermal Management team.