The world of data centers is changing at lightning speed. The demands of AI, hyperscale computing, cloud services, and edge deployments are pushing the boundaries of traditional infrastructure. To stay ahead, the industry is embracing open, scalable, and efficient designs—led by the transformative Open Compute Project (OCP).

At Alexander Schneider, we are proud to be at the forefront of this revolution. We are bringing Vertiv’s OCP-inspired solutions to the Israeli datacenter  based on the Open Rack v3 (ORV3) standard including OCP rack and 50VDC bus bar , advanced power supply shelves, and state-of-the-art liquid cooling technologies.

What is the Open Compute Project (OCP)?

Founded in 2011, the Open Compute Project set out to open-source data center hardware, challenging the closed, proprietary models that dominated the industry. By creating an open ecosystem for servers, storage, networking, and power infrastructure, OCP enables:

• Faster innovation cycles
• Greater energy efficiency
• Lower costs of ownership
• Vendor interoperability

The OCP community includes tech giants like Meta, Google, Microsoft, Intel, and hundreds of vendors globally — collaborating to design the data center of the future.

Why OCP is the Next Frontier

1. Designed for AI and High-Density Computing

AI models today demand unprecedented power and cooling capabilities. OCP-compliant racks, like ORV3, are engineered to handle:

• Power loads exceeding 100kW per rack
• Liquid cooling to efficiently dissipate heat from dense compute nodes
• Advanced interconnects for AI and HPC cluster scaling

2. Sustainability at Scale

Energy efficiency and sustainability are core to OCP designs. By standardizing 48V and ±400V DC power shelves, data centers reduce energy loss and improve Power Usage Effectiveness (PUE). OCP-inspired liquid cooling further minimizes  energy consumption.

 3. Open Standards for Flexibility

OCP eliminates vendor lock-in by providing open specifications for racks, power infrastructure, servers and storage and networking equipment

Alexander Schneider’s OCP-Compliant Solutions Portfolio

Alexander Schneider is proud to bring to Israel a curated suite of Open Compute Project–aligned infrastructure, including Vertiv racks, in-rack DC busbars, power shelves, and liquid cooling solutions, engineered to meet the demands of modern AI, cloud, and HPC deployments.

1. Open Rack v3 (ORv3)

Vertiv OCP V3 system featuring integrated DC busbar infrastructure and support for direct‑to‑chip liquid cooling manifolds—delivered as a turn-key solution for streamlined installation and serviceability 

2. Vertiv™ PowerDirect Rack – OCP Power Shelf

Vertiv’s OCP-compliant power shelf is a 1U, 50V DC solution delivering up to 33kW per shelf and scalable to 132kW per rack with N+N redundancy. It offers 97.5% peak efficiency, reducing energy waste and cooling requirements. The shelf supports both AC and HVDC inputs, ensuring flexibility across power infrastructures. Optimized for ORv3 High-Power Racks, it’s a robust, future-ready choice for AI and HPC data centers.

3. OCP-Inspired Liquid Cooling

Vertiv offers OCP-inspired liquid cooling solutions, featuring manifolds fully compatible with ORv3 blind-mate interfaces for efficient in-rack or row-based thermal distribution. These solutions include reference designs for liquid-to-liquid heat exchange, direct-to-chip cooling, and durable manifold kits built for high-density environments.

Combined, these components form a complete OCP-compliant, high-density infrastructure stack—from rack and power distribution to advanced cooling systems. Our team provides turnkey implementation, including mechanical installation, power integration, cooling setup, monitoring, and support tailored for the Israeli data center market.

Contact us to learn more.