Distribute coolant with precision across your OCP infrastructure.

The Vertiv™ CoolChip Fluid Network is a stainless steel in-rack manifold solution that enables efficient liquid distribution to direct-to-chip cooled IT equipment. With OCP-inspired engineering, the system ensures high performance, leak protection, and fast serviceability — critical for liquid-cooled AI and HPC environments.

 Key Features

  • OCP-Ready Design – Engineered for Open Rack V3 and compatible with industry-standard form factors.
  • Dripless Quick Disconnects – Ensure clean, tool-free servicing and modular upgrades.
  • Universal Mounting – Adapts to different rack types for maximum deployment flexibility.
  • Multiple Coupling Sizes – Supports varied flow rates and loop types.
  • Service-Friendly Architecture – Minimizes downtime and maintenance effort.

 Benefits

  • Enable rack-level liquid cooling with minimal footprint
  • Ensure high reliability with stainless steel construction
  • Improve technician safety and uptime with dry-disconnects
  • Simplify integration into diverse OCP deployments

 Technical Highlight

  • Flow Capacity: Supports up to 100kW per rack
  • Materials: 304 Stainless Steel
  • Connectors: Dry-break style, 3/8” to 1”
  • Pressure: Up to 6 bar
  • Mounting: Universal L-bracket or rail integration

Learn more here.